DS34T108GN+
₹9,792.00
Features of DS34T108GN+
- Fully Equipped IC includes 10/100 MAC, TDMoP Engine, and E1/T1 LIUs and Framers.
- Transport of STS-1 TDM or Other CBR Signals Over Packet Networks or E1, T1, E3, or T3
- SAToP, CESoPSN, TDMoIP AAL1, HDLC, Unstructured, Structured, and Structured with CAS Mapping Methods; Adaptive Clock Recovery, Common Clock, External Clock, and Loopback Timing Modes; and Full Support for These Mapping Methods.
- One-per-port, independently programmable On-Chip TDM Clock Recovery Machines.
- Network PDV, Packet Loss, Constant Delay Changes, Frequency Changes, and Other Impairments are Handled by the Clock Recovery Algorithm.
- 64 Independent Bundles/Connections
- Supports IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, and Metro Ethernet Multiprotocol Encapsulation
- Support for VLAN in accordance with 802.1p and 802.1Q Support for MII/RMII/SSMII in the 10/100 Ethernet MAC
Application? of DS34T108GN+
- Extension of TDM Circuit Over PSN:
- PSN Leased-Line Services
- GPON/EPON Over TDM
- Over Cable TDM
- Over Wireless TDM
- Backhaul Over PSN for Cellular
- Multiple Services through a Single PSN
- Transporting HDLC-Based Traffic Over PSN
2490 in stock
Description of DS34T108GN+
Up to eight E1, T1, or serial streams or one high-speed E3, T3, STS-1 or serial stream may be transparently transmitted over IP, MPLS, or Ethernet networks using these IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices. Recovered clocks’ jitter and wander adhere to G.823/G.824, G.8261, and TDM requirements.
Up to 64 independently customizable bundles can carry TDM data. Except for AAL2, all standards-based TDM-over-packet mapping techniques are supported. Additionally supported are frame-based serial HDLC data transfers. has fully functional E1/T1 frames and LIUs built in.
These ICs preserve the ability to use TDM streams at crucial intermediary points while encapsulating the TDM-over-packet solution from analogue E1/T1 signal to Ethernet MII. The DS34T10x devices’ high level of integration reduces cost, board space, and time to market.
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