L30960-N5130-B100
₹6,528.00
Features? of? L30960-N5130-B100
- LTE (2×2 DL-MIMO; FDD 3GPP Release 9)
- 3GPP Release 8; UMTS/HSPA (FDD); Rx diversity
- 3GPP Release 6; DARP/SAIC; GSM/GPRS/EDGE
- SIM Application Toolkit, version 99 of the 3GPP
- Using AT instructions to control (Hayes, TS 27.007, TS 27.005)
- 3.3 to 4.2 V supply voltage range, especially tuned for low power usage
- Size: 40, 32, and 2,8 mm
- Range of Operation Temperature: -40 ?C to +95 ?
- Compliant with RoHS, RED, and REACH, EuP assistance
Special Features L30960-N5130-B100
- The USB 2.0/3.0 interface provides several composite modes and a mode that is compatible with Linux and Mac.
- USB-based firmware update
249 in stock
Description
Description of L30960-N5130-B100
For demanding, high-performance IoT applications that require LTE advanced connection in harsh environments, L30960-N5130-B100 wireless module is designed. The PLAS9’s Cat. 6 LTE technology offers scorching data speeds of 300 Mbit/s download and 50 Mbit/s uplink in addition to smooth fallback to 3G and 2G networks.
It is the perfect answer for industrial routers and gateways, digital signage, mobile computers used in the workplace, and tablets since it offers dependable coverage in RF-noisy urban areas and areas where 4G is still being developed.
With only two variations?the PLAS9-X and PLAS9-W?the PLAS9 offers global coverage with 3G/2G fallback. Extreme performance and sensitivity as well as connection stability are made possible by the module’s novel RF approach.
Data rates are increased and performance is consistent thanks to MIMO 2×2 antenna connections. PLAS9 offers increased peak user data rates and optimal spectrum utilization with carrier aggregation for better connectivity performance.
With the option to choose the most advantageous soldering paste and stencil height appropriate for each unique application, the exclusive 156 LGA footprint offers optimum heat dissipation that eliminates warping.
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