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L30960-N3410-A400
₹4,352.00
Features of L30960-N3410-A400
- LTE (20,8,3,7,1); 3G (8,3); and 2G Dual Band PLS8-E
- PLS8-US: 3G (5,4,2), 2G Quad Band, and LTE (17,5,4,2).
- LTE (1,3,19); 3G; PLS8-J (1,19)
- PLS8-X: 3G (5,4,2), 2G Quad Band, and LTE (13,17,5,4,2).
- LTE PLS8-V: (13,4,2)
- LTE (2×2 DL-MIMO; FDD 3GPP Release 9)
- 3GPP Release 8; UMTS/HSPA (FDD); Rx diversity
- 3GPP Release 6; DARP/SAIC; GSM/GPRS/EDGE
- SIM Application Toolkit, version 99 of the 3GPP
- Using AT instructions to control (Hayes, TS 27.007, TS 27.005)
- Complete GPS/GLONASS integration (Qualcomm gpsOne Gen8A)
- 3.3 to 4.2 V supply voltage range, especially tuned for low power usage
- Dimensions are 29 mm by 33 mm by 2,2 mm (PLS8-V/-X: H=2,9 mm).
- Range of Operation: -40 ?C to +85 ?C
- EuP support, RoHS and REACH compliance
Special Features of L30960-N3410-A400
- Multiple composite modes and a Linux/Mac-compliant mode are supported by the USB interface.
- USB-based firmware update
- BIP (Bearer Independent Protocol) (Bearer Independent Protocol)
- From Rel.3.0 and for PLS8-X /-V, IP services (Client & Server, TCP/IP & UDP, Transparent & Nontransparent) are available.
- According to 3GPP TS 27.010, a multiplexer
- PLS8-X Automatic Carrier Switching
176 in stock
Description
Description of L30960-N3410-A400
For wireless connectivity both now and in the future, the PLS8 wireless module offers a clever option. The L30960-N3410-A400 is designed for high bandwidth computing and is capable of downlink speeds of up to 100 Mbps and uplink speeds of up to 50 Mbps thanks to 3GPP Rel.
9 LTE technology. It is the perfect choice for industrial gateway routers, video security solutions, medical equipment, and ruggedized mobile computing. The PLS8, together with its variations, the PLS8-E, PLS8-US, PLS8-J, PLS8-X, and PLS8-V, offer Multi Band LTE in addition to seamless fallback to 2G and 3G technologies, providing global coverage and dependability even when roaming across multiple wireless networks.
An modified GPS antenna path prevents blanking for more reliable operation, and two antenna pads offer diversity support for faster data transfer rates. It offers multiple designs through footprint compatibility with Cinterion 3G, CDMA, and advanced LTE modules to protect investment. The LGA footprint allows us the ability to choose the ideal soldering paste and stencil height for each application, resulting in efficient heat dissipation that eliminates warping.
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