features:
– **Peak Pulse Capability:** Can handle pulses up to 1500W with a 10/1000Ī¼s waveform, at a repetition rate (duty cycle) of 0.01%.
– **Package:** Utilizes a DO-201 package with a glass passivated chip junction.
– **Response Time:** Very fast, typically less than 1.0ps from 0 Volts to the minimum breakdown voltage (BV min).
– **Clamping Capability:** Provides excellent protection by clamping voltage spikes.
– **Failure Mode:** Typically fails short under over-specified voltage or current conditions.
– **Whisker Test:** Complies with JEDEC JESD201A standards (table 4a and 4c) for whisker testing.
– **ESD Protection:** Meets IEC 61000-4-2 standards with 30kV protection levels for both air and contact discharge.
– **EFT Protection:** Conforms to IEC 61000-4-4 standards for protecting data lines.
– **Surge Resistance:** Offers low incremental surge resistance.
– **Leakage Current:** Typical leakage current (IR) is less than 1Ī¼A when the minimum breakdown voltage (VBR min) exceeds 12V.
– **Temperature Resistance:** Can withstand high temperatures up to 260Ā°C for 30 seconds during reflow soldering, with specific conditions for lead length and tension.
– **Breakdown Voltage (VBR):** Varies with temperature (TJ) according to the formula VBR @ TJ = VBR @ 25Ā°C x (1 + Ī±T x (TJ – 25)), where Ī±T is the temperature coefficient (typical value of 0.1%).
– **Packaging and Compliance:** Features a plastic package rated V-0 for flammability per Underwriters Laboratories, matte tin lead-free plated finish, and is halogen-free and RoHS compliant.
– **Pb-free E3:** Indicates compliance with Pb-free standards for the second-level interconnect and terminal finish material of tin (Sn), meeting IPC/JEDEC J-STD-609A.01 requirements.
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