features:
– **Peak Pulse Capability**: 1500W at 10/1000Ī¼s waveform, with a repetition rate (duty cycle) of 0.01%.
– **Package**: DO-201 package with glass passivated chip junction.
– **Response Time**: Typically less than 1.0ps from 0 Volts to BV min.
– **Clamping Capability**: Excellent clamping capability.
– **Failure Mode**: Typical failure mode is short from over-specified voltage or current.
– **Whisker Test**: Conducted based on JEDEC JESD201A.
– **ESD Protection**: Complies with IEC 61000-4-2, with 30kV (Air) and 30kV (Contact) protection levels.
– **EFT Protection**: Complies with IEC 61000-4-4 for protection of data lines.
– **Low Incremental Surge Resistance**: Typically less than 1Ī¼A when VBR min > 12V.
– **High Temperature Soldering**: Guaranteed up to 260Ā°C/30sec reflow soldering, with 9.5mm lead length and 2.3kg tension.
– **VBR Temperature Coefficient**: VBR @ TJ = VBR@25Ā°C x (1+Ī±T x (TJ – 25)), where Ī±T (Temperature Coefficient) is typically 0.1%.
– **Flammability Rating**: Plastic package rated V-0 per Underwriters Laboratories.
– **Lead Finish**: Matte tin leadāfree plated.
– **Halogen Free**: Compliant with RoHS regulations.
– **Pb-free E3**: 2nd level interconnect is Pb-free and the terminal finish material is tin (Sn) (IPC/JEDEC J-STD-609A.01).
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