FEATURES:
– **Peak Pulse Capability**: 1500W at 10/1000μs waveform, with a repetition rate of 0.01%.
– **Package**: DO-201 package with a glass passivated chip junction.
– **Response Time**: Typically less than 1.0ps from 0 Volts to BV min (Breakdown Voltage minimum).
– **Clamping Capability**: Excellent at limiting voltage spikes.
– **Failure Mode**: Typically shorts out when exposed to over-specified voltage or current.
– **Whisker Test**: Conforms to JEDEC JESD201A, table 4a and 4c standards.
– **ESD Protection**: Complies with IEC 61000-4-2 standards, with 30kV for both air and contact discharge.
– **EFT Protection**: Meets IEC 61000-4-4 requirements for protecting data lines.
– **Incremental Surge Resistance**: Low, with typical leakage current (IR) less than 1μA when VBR min > 12V.
– **High Temperature Soldering**: Can withstand reflow soldering up to 260°C for 30 seconds with a 9.5mm lead length and 2.3kg tension.
– **Voltage Temperature Coefficient**: VBR varies with temperature (TJ) based on the formula VBR@TJ = VBR@25°C x (1 + αT x (TJ – 25)), where αT is the temperature coefficient (typically 0.1%).
– **Plastic Package**: UL-rated V-0 for flammability.
– **Lead Finish**: Matte tin lead-free plated.
– **Halogen Free and RoHS Compliant**: Environmentally friendly materials and compliant with RoHS standards.
– **Pb-free E3**: Second-level interconnect is lead-free, and the terminal finish material is tin (Sn), meeting IPC/JEDEC J-STD-609A.


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